Bruker (courtesy of Bruker)

Residual Stress With XRD

Residual stress remains in a component once the active force is removed. It originates from microscopic deformation of the crystallites that make up a material. X-ray diffraction is often used to measure this residual stress allowing minimization of undesirable stress conditions to optimize a materials performance. In this video we discuss the origins of residual stress and its measurement and analysis with X-ray diffraction.